LTC3537
20
3537fd
PACKAGE DESCRIPTION
UD Package
16-Lead Plastic QFN (3mm ?/SPAN> 3mm)
(Reference LTC DWG # 05-08-1691)
3.00 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 0.10
BOTTOM VIEWEXPOSED PAD
1.45 0.10
(4-SIDES)
0.75 0.05
R = 0.115
TYP
0.25 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 45 CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 0.05
3.50 0.05
0.70 0.05
0.00 0.05
(UD16) QFN 0904
0.25 0.05
0.50 BSC
PACKAGE OUTLINE
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